Exhibition Achievements 2019

Exhibition Title	Held inside JPCA Show 2019 JISSO PROTEC 2019
Dates	June 5(Wed) - 7(Fri), 2019
Venue	Tokyo Big Sight, JAPAN West Hall 1 Booth：1-102 West Hall 7 3D-MID Pavilion
Main Exhibit Products	Pb Free VPS Reflow Soldering Manual Die Bonder/Manual Flip Chip Bonder Multifunction Bond Tester Atmospheric Pressure ・Low Pressure Plasma Clearner Organic photo-detector/image sensor Flexible electronics Thermoplastic Adhesives STAYSTIK High thermal conductive die-attach paste Electrically conductive adhesive ATROX

Exhibition Title	Held inside NEPCON JAPAN 2019 20th IC PACKAGING TECHNOLOGY EXPO
Dates	January 16(Wed) - 18(Fri), 2019
Venue	Tokyo Big Sight East Hall 3, JAPAN Booth：E25-002
Main Exhibit Products	Wedge Wire Bonder Multifunction Bond Tester Pb Free・3D mounting・Void-less support VPS Reflow Soldering system Vacuum / pressurize reflow system Manual Die Bonder/Manual Flip Chip Bonder Atmospheric Pressure ・Low Pressure Plasma Clearner Thermoplastic Adhesives STAYSTIK High thermal conductive die-attach paste Electrically conductive adhesive ATROX