Products | 產品總覽
Semiconductor manufacturing equipment/material
Wedge Wire Bonder
Wedge wire bonder has advantage of high speed bonding and wide bonding area.This product is the best use for power devices in vehicles.
New Model Wedge/Ribbon Bonder for Power Module Applications
Asterion is designed to beltless direct-drive motion system and improved productivity(UPH) for power module applications by new release functions.
Convertible for large wire, Small wire and PowerRibbon New Model Wedge Bonder
New direct-drive motion system and our next generation Pattern Recognition technology delivered PowerFusion's industry leading productivity and reliability for discrete applications.
Bond Tester(Pull Tester /Shear Tester)
Multifunctional bond tester, Condor Sigma, is capable of testing not only bonding wire pull/shear strength but also die shear maximum 200kgf.
Pb Free・3D mounting・Void-less support
VPS Reflow Soldering system
These are VPS reflow, VPS vacuum reflow system which utilize saturated vapor generated from inert liquid and are the most suitable for ; *High-density mounted substrate, *BGA mounted substrate which requires calorific value, *3D-MID mounted substrate, *Solder reflow for the work including large size jig, *The work to which many size and many kinds of parts are mounted and difficult for uniform heating, *high-reliability solder reflow which requires flux-less and void-free.
Vacuum / pressurize reflow system
Batch type vacuum / pressurize reflow system which respond to the next generation reflow process and realizing void-less soldering.
The microfocus X-ray system
Y. Cougar SMT is X-ray inspection/CT Scan System which has the best resolution and easy operation.
Sintering System
This is an advanced sintering equipment that contributes to reducing maintenance and downtime. It can make contact with all mounted components on the substrate and is capable of sintering dies of different heights and substrates of various shapes.
Power Semiconductor Tester
This is an electrical characteristic testing system for power devices that handles all necessary electrical characteristic tests with a single unit. From wafer level to final product testing, ISO, AC, and DC tests for all power device applications can be performed with this one tester.
Atmospheric Pressure ・Low Pressure Plasma Systems
Plasma Systems is the best use for surface cleaning, processing, and improving.The two different plasma effects are available: low pressure plasma and atmospheric plasma.
Manual Die Bonder/Manual Flip Chip Bonder
For over 30 years, Tresky has been creating die bonder starting from manual to automatic. Various options are available for all sorts of application.
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