Date |
Matter |
December, 1989 |
Techno Alpha Co., Ltd. established in Minato-ku, Tokyo. |
January, 1990 |
We contracted distributorship agreement with Orthodyne Electronics Corporation for wedge wire bonder. |
November, 1995 |
Our headquarter office moved to Gotanda, Tokyo. |
August, 1997 |
We contracted distributorship agreement with Deweyl Tool Company, Inc for bonding tool. |
December, 1998 |
We had business transfer from Inchcape Machinery for Life boat and Davit. |
October, 2000 |
We contracted distributorship agreement with Advanced Integrated Technologies, Inc. for an electrode. |
December, 2001 |
We created rooms for demonstration and training in our headquarter office. |
May, 2002 |
We established Technical Service Center in Nagoya, Japan. |
October, 2003 |
We contracted distributorship agreement with New Logic Research, Inc. for Vibrated Membrane Filter. |
September, 2004 |
Enter into sale of our original brand of Flip-chip Die-bonder. |
January, 2005 |
We contracted distributorship agreement with Diener Electronic GmbH for Plasma Cleaner equipment. |
October, 2007 |
We Techno Alpha Co., Ltd. went public on the Osaka Stock Exchange “Hercules",currently "JASDAQ". |
May, 2009 |
We Techno alpha Co., Ltd. subsidy Comtech corporation. |
January, 2010 |
We contracted distributorship agreement with Kulicke&Soffa (Japan), Ltd. for Ball-Bonder equipment. |
May, 2010 |
Enter into sale of Vacuum Reflow Soldering equipment from PINK GmbH Thermosysteme. |
January, 2011 |
We contracted distributorship agreement with DR. TRESKY AG for Manual Die-Bonder and Manual Flip-chip Bonder. |
March, 2011 |
We contracted distributorship agreement with Plan Optik AG for glass substrates. |
September, 2011 |
We Techno Alpha Co., Ltd. acquired 100% ownership of Peritec Corporation. |
December, 2011 |
We Techno Alpha Co., Ltd. mergerd Comtech Corporation. |
January, 2014 |
We Techno Alpha Co., Ltd. acquired 100% ownership of KYA technologies corporation. |
March, 2019 |
We Techno Alpha Co., Ltd. mergerd KYA technologies corporation. |